Just a month before the
iPhone 7's expected unveiling, a few new images allegedly depicting the device's
Bare main
Logic board have surfaced on Chinese microblogging site Weibo (via
Steve Hemmerstoffer), showing the major part before any of the device's chips have been added onto the circuit board. **t much context is given in the images thanks to the lack of chips, but it is widely believed that the 2016
iPhone will house a next-generation A10 processor,
produced solely using TSMC's 10-na**meter manufacturing process.
Front of iPhone 7 Logic board
The
Logic board layout is generally consistent with previous iPhones, with a large ***** on the front corresponding to the location of the A10 main chip that appears to be roughly the same size as the current A9 chip used in the
iPhone 6s. The A10 does appear to sit a bit higher on the
Logic board than usual, however, with a**ther significant chip placed between the A10 and the SIM card lot in the center of the board.
Rear of iPhone 7 Logic board
Other internal parts of the
iPhone 7 have leaked this year, like a
Lightning cable assembly image in May, which opposed rumors that the new
iPhone devices will ditch the 3.5 mm headphone jack in favor of a sole Lightning port for both audio and charging. Given the steady growth of rumors surrounding a Lightning-only
iPhone 7 in 2016 -- with multiple reports this summer focused on
Lightning-enabled EarPods and
Accessories -- the internal cable assembly leak from May appears false.
In June, Weibo was the source of a**ther internal
iPhone 7 leak that showed
dual SIM trays as a possibility for this year's iPhone. Today's
Logic board leak, however, shows a space for the SIM slot that appears nearly identical to current iPhones and smaller than the leaked dual-SIM tray, suggesting that the dual-SIM leak was also false.
Related Roundup:
iPhone 7
Discuss this article in our forums
أكثر...